2024.05.13
Tokyo Tech’s BBCube Technology to drive new next-generation 3D integration manufacturing lines by Tech Extension Co. and Tech Extension Taiwan
Realizing social implementation of next-generation 3D stacked semiconductor technology
Tokyo Institute of Technology’s WOW Alliance has facilitated a groundbreaking agreement between Tech Extension Co., Ltd. (TEX), Tech Extension Taiwan Co., Ltd. (TEX-T), and Innolux Corporation (INNOLUX) to construct a next-generation 3D integration manufacturing line using the Bumpless Build Cube (BBCube) technology in an INNOLUX cleanroom.
TEX will transfer WOW technology and COW technology, which are both based on the BBCube technology platform, to this manufacturing line intended for next-generation 3D integration. This technology transfer utilizes processes, equipment, and materials.
Also, TEX and TEX-T will take the lead in building the next-generation 3D integration manufacturing line and are scheduled to concurrently conduct research and development, including human resource development, in collaboration with the Tokyo Tech WOW Alliance, National Cheng Kung University (NCKU), and other universities and industries.
A next-generation semiconductor integrated manufacturing line that encompasses manufacturing from WOW manufacturing to COW manufacturing will be built to take advantage of the WOW and COW technologies, which are based on the platform for BBCube technology possessed by TEX and TEX-T, aiming at utilizing the WOW and COW technologies as post-miniaturization core technologies.
In the future, equipment will be launched sequentially from Q4 in 2024, and an integrated manufacturing line is scheduled to be launched by Q3 in 2025, thus sequentially applying the WOW and COW technologies, which are based on the BBCube platform.
