2023.07.11
BBCube 3D: A Breakthrough in Semiconductor Integration and Data Transmission
A technology for the three-dimensional integration of processing units and memory, as reported by researchers from Tokyo Tech, has achieved the highest attainable performance in the whole world, paving the way to faster and more efficient computing. Named “BBCube 3D,” this innovative stacked architecture achieves higher data bandwidths than state-of-the-art memory technologies, while also minimizing the energy needed for bit access.
